JPS6364081B2 - - Google Patents
Info
- Publication number
- JPS6364081B2 JPS6364081B2 JP53043596A JP4359678A JPS6364081B2 JP S6364081 B2 JPS6364081 B2 JP S6364081B2 JP 53043596 A JP53043596 A JP 53043596A JP 4359678 A JP4359678 A JP 4359678A JP S6364081 B2 JPS6364081 B2 JP S6364081B2
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- electrode
- inductance
- capacitor
- internal matching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Microwave Amplifiers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4359678A JPS54134976A (en) | 1978-04-12 | 1978-04-12 | High-frequency transistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4359678A JPS54134976A (en) | 1978-04-12 | 1978-04-12 | High-frequency transistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54134976A JPS54134976A (en) | 1979-10-19 |
| JPS6364081B2 true JPS6364081B2 (en]) | 1988-12-09 |
Family
ID=12668176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4359678A Granted JPS54134976A (en) | 1978-04-12 | 1978-04-12 | High-frequency transistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54134976A (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0395993A (ja) * | 1989-09-07 | 1991-04-22 | Matsushita Electric Ind Co Ltd | フロントパネル取付構造 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04282908A (ja) * | 1991-03-12 | 1992-10-08 | Matsushita Electric Ind Co Ltd | 高域通過フィルタ及びこれを用いた多段増幅器 |
| JPH05327371A (ja) * | 1992-05-15 | 1993-12-10 | Mitsubishi Electric Corp | Ｆｅｔ増幅器 |
| JP6164721B2 (ja) * | 2012-11-09 | 2017-07-19 | 住友電工デバイス・イノベーション株式会社 | 半導体装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6031103B2 (ja) * | 1975-12-15 | 1985-07-20 | 日本電気株式会社 | 高周波用高出力トランジスタ装置 |
| JPS52127732A (en) * | 1976-04-19 | 1977-10-26 | Nec Corp | High output transistor unit for high frequency |
-
1978
- 1978-04-12 JP JP4359678A patent/JPS54134976A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0395993A (ja) * | 1989-09-07 | 1991-04-22 | Matsushita Electric Ind Co Ltd | フロントパネル取付構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54134976A (en) | 1979-10-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5164683A (en) | RF amplifier assembly | |
| US5352998A (en) | Microwave integrated circuit having a passive circuit substrate mounted on a semiconductor circuit substrate | |
| US7372334B2 (en) | Output match transistor | |
| US5760650A (en) | Coplanar waveguide amplifier | |
| US5233313A (en) | High power field effect transistor amplifier | |
| US4213141A (en) | Hybrid transistor | |
| US4298846A (en) | Semiconductor device | |
| JP2001111364A (ja) | マイクロ波増幅器 | |
| JP2000312122A (ja) | 高周波入力整合回路装置及び高周波出力整合回路装置及び、半導体集積回路 | |
| JPS6364081B2 (en]) | ||
| JP2738701B2 (ja) | 高周波増幅回路 | |
| JPS6114183Y2 (en]) | ||
| US4267520A (en) | Hybrid component for very high frequency amplification | |
| JPS584483B2 (ja) | 高周波高出力トランジスタ増幅器 | |
| JPS6032749Y2 (ja) | チップ形静電容量素子 | |
| JPS6114182Y2 (en]) | ||
| JP2880023B2 (ja) | 高周波トランジスタ回路 | |
| JPH02140969A (ja) | 半導体集積回路装置 | |
| US12401325B2 (en) | Doherty amplifier | |
| US20220407467A1 (en) | Doherty amplifier | |
| JP2986391B2 (ja) | 高周波半導体装置 | |
| JPS6035247Y2 (ja) | 半導体装置 | |
| JPS6114671B2 (en]) | ||
| JPS5929377Y2 (ja) | 高周波高出力トランジスタ装置 | |
| JPH0363315B2 (en]) |